- Published: January 2024.
- Pages: 330
- Tables: 22
- Number: 25
- Series: Electronic
The global landscape of semiconductor manufacturing is rapidly evolving, with advanced packaging emerging as a critical component of manufacturing and design. At a macro level this impacts power, performance and cost, and at a micro level it affects the basic functionality of every chip. Advanced packaging allows different chips to be integrated to create faster, more cost-effective systems. This is an increasingly essential technology given the physical limitations of conventional chip miniaturization. It is reshaping the industry by enabling integration of different chip types and increasing processing speeds.
The U.S. government recognizes the importance of advanced packaging and has introduced a $3 billion National Advanced Packaging Manufacturing Program with the goal of building high-volume packaging facilities by the end of 2010. The focus on packaging complements existing efforts under CHIPS and the Science Act, emphasizing the interconnectedness of chip manufacturing and packaging.
Global Market for Advanced Semiconductor Packaging 2024 to 2035 provides a comprehensive analysis of the global Advanced Semiconductor Packaging Technology Market from 2020 to 2035. It covers packaging approaches such as wafer-level packaging, 2.5D/3D integration, chiplets, fan-out, and flip chip, and analyzes the multi-billion dollar market value by type, region, and end-use application.
Trends analyzed include heterogeneous integration, interconnection, thermal solutions, miniaturization, supply chain maturity, and simulation/data analytics. Major companies introduced include TSMC, Samsung, Intel, JCET, and Amkor. Applications covered include AI, mobile, automotive, aerospace, IoT, telecommunications (5G/6G), high-performance computing, healthcare and consumer electronics.
Regional markets explored include North America, Asia Pacific, Europe, China, Japan, and RoW. The report also evaluates drivers such as ML/AI, data centers, and EV/ADAS. Challenges such as cost, complexity and reliability; New approaches such as system-in-package, monolithic 3D ICs, advanced substrates, and new materials. A comprehensive, in-depth benchmark analysis of opportunities within the evolving semiconductor packaging industry.
The contents of the report are as follows:
- Market size and outlook
- Key technology trends
- Growth Drivers and Challenges
- Competitive environment analysis
- Future packaging trend outlook
- A Deep Dive into Wafer Level Packaging (WLP)
- System in Package (SiP) and Heterogeneous Integration
- Monolithic 3D IC Overview
- Advanced semiconductor packaging applications across key markets including AI, mobile, automotive, aerospace, IoT, communications, HPC, medical, and consumer electronics.
- Regional Market Analysis
- Assess key industry challenges: complexity, cost, supply chain maturity, and standards
- Company Profiles: Strategies and technologies of 90 leading companies. Companies profiled include 3DSEMI, Amkor, Chipbond, ChipMOS, Intel Corporation, Leader-Tech Semiconductor, Powertech, Samsung Electronics, Silicon Box, SJ Semiconductor Corp., SK hynix, SPIL, Tongfu, Taiwan Semiconductor Manufacturing Company (TSMC), and There is Yuehai Integrated.
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Global Market for Advanced Semiconductor Packaging (2024-2035)
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Global Market for Advanced Semiconductor Packaging (2024-2035)
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